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Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes

SAN JOSE, Calif., May 27, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is expanding its collaboration with TSMC to accelerate mobile, AI and hyperscale computing application design using the integrated Cadence® digital flow and custom/analog tool suite on TSMC’s N3 and N4 process technologies. Joint Cadence and TSMC customers have already successfully…
Chin Chi Teng Suk Lee Digital Signoff Group At Cadence Design Infrastructure Management Division Cadence Design Systems Inc Companies To Work

Cadence collaboration with Arm enables tape-out of next-generation mobile designs

Cadence collaboration with Arm enables tape-out of next-generation mobile designs Cadence Design Systems has announced that a collaboration with Arm has enabled customers to successfully tape-out next-generation Arm mobile designs. According to Cadence, customers have successfully taped out mobile SoCs using its tools for the next-generation Arm mobile solution, which includes the Arm Cortex-X2, Cortex-A710, and Cortex-A510 CPUs, Mali-G710 GPU and the DynamIQ Shared Unit...
Chin Chi Teng Software Solution Digital Signoff Group At Cadence Cadence Design Systems Design Systems Arm Cortex X

Cadence Collaborates with Arm to Accelerate Hyperscale Computing, 5G Communications SoC Development

Cadence Collaborates with Arm to Accelerate Hyperscale Computing, 5G Communications SoC Development Cadence Design Systems, Inc. announced that it is expanding its collaboration with Arm to speed hyperscale computing and 5G communications SoC development using Cadence® tools and the new Arm® Neoverse™ V1 and Neoverse N2 platforms. To build upon previous silicon successes where leading customers used the first-generation Arm...
Chris Bergey Chin Chi Teng Ghz Neoverse Software Solution Digital Signoff Group At Cadence Cadence Design Systems Inc

Cadence Collaborates with Arm to Accelerate Hyperscale Computing and 5G Communications SoC Development

Highlights: Latest collaboration builds upon previous successes where leading server customers reached silicon on 7nm using the previous-generation Arm Neoverse N1 platform and Cadence tools Cadence optimized its RTL-to-GDS digital full flow and delivered corresponding 5nm and 7nm RAKs for Arm Neoverse V1 and Neoverse N2 platforms, enabling designers to get to market faster Cadence’s verification full flow enables Neoverse V1 and Neoverse N2 platform users to achieve highest verification thro...
Chris Bergey Chin Chi Teng Ghz Neoverse Software Solution Digital Signoff Group At Cadence Cadence Design Systems Inc

Collaboration looks to accelerate hyperscale computing SoC design

Collaboration looks to accelerate hyperscale computing SoC design Cadence Design Systems has revealed that it has optimised the Cadence digital 20.1 full flow for Samsung Foundry’s advanced-process technologies down to 4nm. As a consequence of the companys collaboration designers can now use Cadence tools to achieve optimal power, performance, and area (PPA) and deliver accurate, first-pass silicon for hyperscale computing applications. Cadences digital 20.1 flow is...
Sangyun Kim Michael Jackson Software Solution Digital Signoff Group At Cadence Foundry Design Technology Team Samsung Electronics

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Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs

December 17, 2020 Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications SAN JOSE, Calif., December 16, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence® system analysis and advanced packaging design tool flo...
Ben Gu Sangyun Kim Sigrity System Cadence Design Systems Inc Group At Cadence Companies To Work

Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs – IT Business Net

Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence ® system analysis and advanced packaging design tool flow as a Samsung Mu...
Ben Gu Sangyun Kim Sigrity System Cadence Design Systems Inc Group At Cadence Companies To Work

ATR Extra: Comparing AIBA Presidential Candidates' Manifestos

ATR Extra: Comparing AIBA Presidential Candidates Manifestos 12/08/20 (ATR) Candidates to lead the international boxing federation make their final push for election as voting nations compare manifestos. Suleyman Mikayilov of Azerbaijan (Mikayilov) Among the seven contenders, five have released their platforms, with Suleyman Mikayilov of Azerbaijan providing the most detailed vision and strategic plan in 82 pages. Ramie Al-Masri of Germany has the shortest at two pages. Anas Al-Otaiba of Unit...
France General Dominican Republic United Arab Emirates Karen Rosen Umar Kremlev Domingo Solano

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