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January 12, 2024
High porosity Co-Al-Fe intermetallic with 3D-microstructures were one-step synthesized via a novel thermal explosion reaction. A link between pore structure and permeability was established using 3D-XRM technology. The corrosion resistance of the samples with different Fe contents was investigated at 900 °C under an oxygen/sulphur atmosphere for up to 120 h. The results showed that the pore structure of the samples remains stable, and the internal matrices are intact due to the formation of a t...
January 11, 2024
Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level.
October 6, 2023
Copper/aluminum (Cu/Al) composites with multifunctional applications have been extensively applied in a variety of fields. Nevertheless, the formability of Cu/Al composite strips during micro flexible rolling (MFR) has not been fully investigated in the sub-millimetre range. In the present work, the microstructure, mechanical properties and formability of Cu/Al composite strips during MFR were studied. The microstructure of the annealed and rolled specimens were characterized using scanning elec...
October 20, 2022
Hydrogen has the highest energy density (120 MJ/kg) of all known substances, approximately three times more than diesel or gasoline, meaning it could play a pivotal role in sustainable energy syst ...