Wireless module vendor Murata developed Type 1XL high performance Wi-Fi 6 and Bluetooth 5.3 module by using semiconductor chips from NXP Semiconductors.
Murata used a combo WiFI6 and Bluetooth 5.3 chipset from NXP Semiconductor for a compact 2 x 2 MIMO module that measures 19.1 mm x 16.5 mm x 2.1 m for embedded designs. The Type 1XL module uses proprietary packaging and miniaturization technologies around the NXP 88W9098 combo chipset. This supports IEEE 802.11a/b/g/n/ac/ax 2×2 multi-user, […]