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Synopsys Accelerates Multi-Die Designs with Industry's First Complete HBM3 IP and Verification Solutions – EEJournal

MOUNTAIN VIEW, Calif., Oct. 7, 2021 /PRNewswire/ -- Highlights of this Announcement: The DesignWare HBM3 Controller, PHY, and Verification IP reduces integration risk and maximizes memory performance in 2.5D multi-die systems Low-latency HBM3 Controller with flexible configuration options enhance memory bandwidth Pre-hardened or configurable HBM3 PHY in 5-nm process operates at 7200 Mbps for up to 2X…
John Koeter Yutaka Hayashi Mark Montierth Memory Product Planning At Samsung Electronics Synopsys Inc Data Center Networking Business Unit At Socionext

Winbond's OctalNAND Flash interoperates with Synopsys DesignWare AMBA IP

Winbonds OctalNAND Flash interoperates with Synopsys DesignWare AMBA IP Winbond Electronics has announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP with the companys OctalNAND Flash Memory. The DesignWare SSI IP, offering high transfer rates and low latency in serial flash memories and OctalNAND Flash deliver a complete NAND flash memory solution for automotive, mobile and IoT SoCs, enabling faster adoption of octa...
John Koeter Winbond Octal Technology Executive Of Winbond Flash Memory Winbond Electronics Synopsys Designware Synopsy Designware Synchronous Serial Interface

Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution – EEJournal

July 21, 2021 Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution Solution optimizes data transfer rate with low latency for NAND with serial octal interface targeting automotive, mobile and IoT SoCs Taichung, Taiwan – 2021-07-21 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the successful interoperability of Synopsys’ DesignW...
John Koeter Winbond Octal Technology Executive Of Winbond Flash Memory Winbond Electronics Corporation Synopsy Designware Synchronous Serial Interface Iot Socs

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Synopsys Expands Multi-Die Solution Leadership with Industry's Lowest Latency Die-to-Die Controller IP – EEJournal

MOUNTAIN VIEW, Calif., June 3, 2021 /PRNewswire/ -- Highlights of this Announcement: The complete DesignWare Die-to-Die IP solution, including controller, 112G USR/XSR and HBI PHYs, supports die splitting and compute scaling New Die-to-Die Controller's error correction mechanisms with replay and optional forward error correction minimize bit error rate for reliable die-to-die links Low-latency architecture supports AMBA CXS…
John Koeter Jeff Defilippi Arm Coherent Mesh Network Coherent Mesh Network Synopsys Inc Designware Die To

Synopsys DesignWare IP Achieves Broad Industry Adoption with Multiple First-Pass Customer Silicon Successes on TSMC's N5 Process – EEJournal

June 1, 2021 Synopsys DesignWare IP Achieves Broad Industry Adoption with Multiple First-Pass Customer Silicon Successes on TSMC’s N5 Process High-Quality Interface and Foundation IP Adopted by More Than 20 Leading Semiconductor Companies, Across Range of Automotive, Mobile and High-Performance Computing Markets MOUNTAIN VIEW, Calif., June 1, 2021 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced that its broad DesignWare® Interface, Logic Library, Embedded Memory and PVT m...
John Koeter Synopsy Designware Suk Lee Design Infrastructure Management Division Logic Library Synopsys Inc

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