No small debate when it comes to defect size
Medical package testers are revealing a lot more about their subjects these days. How? Using high-frequency ultrasound, for one. With it, engineers can locate defects as small as 10 µm in packages. Attendees of HealthPack 2003 heard this news from Jack Richtsmeier, business development manager of Sonoscan Inc. The firm’s technology, Acoustic Micro Imaging (AMI), can locate voids, cracks, delaminations, and disbonds in many types of medical and pharmaceutical packaging. Cardinal Health, for i...
Source: packagingdigest.com