Micro Bump News Today

[SPONSORED CONTENT]  High performance computing (HPC) often sets trends for the data center. Driving innovation, adding new functionality, and enabling [...]

The Nano-focus X-ray Inspection System from SEC is equipped with a Nano-focus Tube of 200-nm resolution, which is dedicated to semiconductor packaging and wafer level packaging (WLP), where sub-micron defects need to be detected. The system can accurately trace and inspect damaged areas by precisely moving the axis with an anti-vibration table. Wafer bump automatic inspection is available throughout Oblique CT / Cone Beam CT. Features High-resolution image with dual-type CTs Application Proces...