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05/24/2021 | Press release | Distributed by Public on 05/24/2021 00:14 GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric™ Advanced Packaging Technology Hsinchu, Taiwan - May 24, 2021 - Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces GLink-3D die-on-die interface IP using TSMCs N5 and N6 processes and 3DFabric™advanced packaging technology for AI, HPC, and Networking applications. AI/HPC/Networking memory demand is growing quickly ...

Marvell Completes Acquisition of Inphi News provided by Share this article Share this article SANTA CLARA, Calif., April 20, 2021 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions today announced the completion of its acquisition of Inphi Corporation. The combination creates a U.S. semiconductor powerhouse positioned for end-to-end technology leadership in data infrastructure. The combined company, Marvell Technology, Inc. ("Marvel...