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GUC announces GLink-3D Die-on-Die interface IP

GUC announces GLink-3D Die-on-Die interface IP Global Unichip (GUC), an ASIC developer, has announced GLink-3D die-on-die interface IP using TSMCs N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking applications. With AI, HPC and networking memory demand growing there is a need for SRAM/Logic disintegration allowing the implementation of separate SRAM and Logic at the most efficient process nodes. Layers of CPU and SRAM (Last Leve...
Ken Chen Igor Elkanovich Network Processors Last Level Cache கேன் சென் வலைப்பின்னல் ப்ராஸெஸர்ஸ்

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