New Models Added to CUI Devices' Line of BGA Heat Sinks – EEJournal
LAKE OSWEGO, Ore. — May 1, 2024 — CUI Devices’ Thermal Management Group today announced the expansion of its line of BGA heat sinks. Compatible with ball grid array (BGA) devices, the HSB family now offers aluminum or copper material options, clean or black anodized material finishes, and adhesive or PCB mounting styles. All BGA heat sink models are conveniently…
Source: eejournal.com