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TSMC details 12 8 Tbps on-package communication solution — an efficient silicon photonics interconnect for AI

TSMC goes optical with a 3D stacked silicon photonics interconnect called COUPE — Compact Universal Photonic Engine. It could deliver up to 12.8 Tbps of on-package connectivity for future chip designs.

TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12 8 Tbps COUPE On-Package Interconnect

TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12 8 Tbps COUPE On-Package Interconnect
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Coherent to Demonstrate Next-Generation Transceiver Technology for Digital Coherent Optics in Ultracompact Pluggable Form Factors for Disaggregated Systems at ECOC 2023

The live demonstrations will include the following: 800G coherent optical engine based on the 140 GBaud IC-TROSA from Coherent and the Orion DSP from Marvell400ZR and 400G OpenZR+ QSFP-DD DCO.

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