Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow – EEJournal
Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. Leveraging the expertise and world class technology of Siemens' industry leading IC and PCB design portfolios, Intel’s EMIB technology delivers advanced integrated…
Rahul Goyal Siemens Xcelerator Package Assembly Design Kit Siemens Digital Industries Software Intel Foundry Vice President
Source: eejournal.com