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December 5, 2023
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August 31, 2023
31 August 2023 Advanced Metrology for SiC Crystal Quality Improvement Oxford Instruments Confirms Crystal Quality Improvement for SiC Substrate Polishing...
September 8, 2022
Recently Oxford Instruments announced the launch of their SiC substrate contactless plasma polishing solution. The aim of this technology is to supersede the established chemical mechanical planarization CMP process, with a clean, dry, lower cost, higher yield and sustainable alternative.