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The annual IEEE International Solid-State Circuits Conference covers a range of topics of interest to AnandTech. Every year the conference includes a session on non-volatile memories where most of the NAND flash memory manufacturers share technical details of their latest developments. At the conference we get more information than these companies are usually willing to share in press briefings, and the presentations are usually about technology that will be hitting the market during the coming year. At ISSCC 2021 this week, four of the six major 3D NAND flash memory manufacturers are presenting their newest 3D NAND technology. Samsung, SK hynix and Kioxia (+Western Digital) are sharing their latest 3D TLC NAND designs and Intel is presenting their 144-layer 3D QLC NAND. Not participating this year are Micron (who announced their 176L 3D NAND late last year) and Chinese newcomer YMTC.

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