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Cadence Introduces the Voltus-XFi Custom Power Integrity Solution, Delivering over 3X Productivity Gains

SAN JOSE, Calif., July 07, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence® Voltus™-XFi Custom Power Integrity Solution, a custom electromigration and IR drop (EM-IR) solution that delivers improved ease of use with minimal tuning and enables the development of efficient, low-power ICs. Using the new Voltus-XFi solution, which is seamlessly integrated…
Sangyun Kim Tom Beckley Alan Poon Simon Leigh Elevate Semiconductor Six Semiconductor Inc

Cadence Digital and Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes

Highlights: • Companies collaborate to accelerate next-generation mobile, AI and hyperscale design innovation • Customers actively designing with new N3E and N4P PDKs • Cadence digital and custom/analog flows optimized to support N3E and N4P requirements, enabling optimal PPA results and improved designer productivity SAN JOSE, Calif., June 13, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS)…
Chin Chi Teng Suk Lee Application Library Environment Digital Signoff Group At Cadence Design Infrastructure Management Division Cadence Design Systems Inc

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Cadence and UMC collaborate on 22ULP/ULL reference flow certification

Cadence and UMC collaborate on 22ULP/ULL reference flow certification Cadence Design Systems and the semiconductor foundry, UMC, have announced that the Cadence digital full flow has been optimised and certified for the UMC 22ULP/ULL process technologies to accelerate consumer, 5G and automotive application design. The flow, which incorporates leading implementation and signoff technology for ultra-low power designs, will enable customers to achieve a much faster path to...
Kam Kittrell Digital Signoff Group At Cadence Design Support Division Chip Development Cadence Design Systems Design Systems

Cadence collaboration with Arm enables tape-out of next-generation mobile designs

Cadence collaboration with Arm enables tape-out of next-generation mobile designs Cadence Design Systems has announced that a collaboration with Arm has enabled customers to successfully tape-out next-generation Arm mobile designs. According to Cadence, customers have successfully taped out mobile SoCs using its tools for the next-generation Arm mobile solution, which includes the Arm Cortex-X2, Cortex-A710, and Cortex-A510 CPUs, Mali-G710 GPU and the DynamIQ Shared Unit...
Chin Chi Teng Software Solution Digital Signoff Group At Cadence Cadence Design Systems Design Systems Arm Cortex X

Collaboration looks to accelerate hyperscale computing SoC design

Collaboration looks to accelerate hyperscale computing SoC design Cadence Design Systems has revealed that it has optimised the Cadence digital 20.1 full flow for Samsung Foundry’s advanced-process technologies down to 4nm. As a consequence of the companys collaboration designers can now use Cadence tools to achieve optimal power, performance, and area (PPA) and deliver accurate, first-pass silicon for hyperscale computing applications. Cadences digital 20.1 flow is...
Sangyun Kim Michael Jackson Software Solution Digital Signoff Group At Cadence Foundry Design Technology Team Samsung Electronics

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