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Intel unveiled its HPC roadmap at ISC 2022, including its 800W Rialto Bridge GPU, Falcon Shores XPU, and Ponte Vecchio CPUs with HBM

Intel plans to invest US$3.5 billion to upgrade its New Mexico manufacturing site with capabilities to produce next-generation processors that make use of the chipmaker’s Foveros 3D packaging technology – a crucial change in how Intel will make chips in the future. The US$3.5 billion investment at Intel’s Rio Rancho, New Mexico, campus, announced Sunday during an interview with 60 Minutes and detailed in a Monday press conference, will create 700 high-tech jobs and 1,000 construction jobs...

Intel’s $3.5B New Mexico Campus Upgrade To Boost Next-Gen Chips The $3.5 billion upgrade will give Intel’s New Mexico manufacturing site the ability to produce next-generation processors with Intel’s Foveros 3D packaging technology, a key part of the company’s new IDM 2.0 strategy it says will lead to processors with greater performance in a smaller footprint. By Dylan Martin May 03, 2021, 02:22 PM EDT Intel plans to invest $3.5 billion to upgrade its N...

Jan 27, 2021 11:41 EST Intel recently unveiled one of the biggest chips we have ever seen and we instantly reached out to some of our sources for further details. While we had an idea of what to expect due to technical disclosures on Architecture Day we were still blown away by what we learned. You are looking at what is the first Intel 7nm die shot (of a packaged product) and courtesy of our sources, the full correct annotation for what you are seeing is finally here. Intels Xe HPC 2-til...