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New Electronics - CSA Catapult and SMD Semiconductor sign landmark collaboration agreement

The Compound Semiconductor Applications (CSA) Catapult and SMD Semiconductor have signed a memorandum of understanding (MoU) to work together in the design, prototyping and manufacturing of next-generation semiconductor and compound semiconductor chips in the automotive and space industries.
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Press Briefing by Press Secretary Jen Psaki, April 12, 2021

James S. Brady Press Briefing Room 12:23 P.M. EDT ย  MS. PSAKI:ย  Hello, everyone.ย  Okay, happy Monday. ย I know we have a busy afternoon for all of you, so we will try to get through as many questions as we can possibly get through.ย  I just have two items for you at the top. ย  This morning, the White House โ€” we released 50 state-by-state factsheets, in addition to factsheets for Puerto Rico and the District of Columbia, laying out the critical necessity of passing the American Jobs Plan s...
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