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June 9, 2022
Winbond Electronics, a supplier of memory solutions, has announced that its TrustME W77Q Secure Flash had obtained Security Evaluation Scheme for IoT Platforms (SESIP) Level 2 with Physical Attacker Resistance Certification.
June 8, 2022
Taiwan based memory chipmaker Winbond Electronics announced that its TrustME W77Q Secure Flash had obtained Security Evaluation Standard for IoT Platforms (SESIP) Level 2 with Physical Attacker Resistance Certification.
June 3, 2022
TAICHUNG, Taiwan—2022-5-31— Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the Company’s TrustME® W77Q Secure Flash had obtained Security Evaluation Standard for IoT Platforms (SESIP) Level 2 with Physical Attacker Resistance Certification. This is the first certification using GlobalPlatform® SESIP Profile for Secure External Memories, and NIST 8259A (IoT device cybersecurity capability core baseline).…
June 1, 2022
Winbond Electronics, a supplier of memory solutions, has announced that its TrustME W77Q Secure Flash has obtained Security Evaluation Standard for IoT Platforms (SESIP) Level 2 with Physical Attacker Resistance Certification.
August 12, 2021
Winbond Electronics has revealed that the company’s TrustME W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C Ready certifications from SGS Brightsight and SGS-TÜV Saar, respectively.