Smart Embedded Display News Today

Winbonds advanced memory solutions are revolutionizing the landscape for a smarter future. Their cutting-edge technology promises unparalleled efficiency and reliability, catering to diverse applications such as IoT, automotive, and AI. With a focus on innovation and sustainability, Winbond is driving the evolution of memory solutions towards a brighter tomorrow. https://x.com/winbondflash?s=11&t=AeRzygEEIHmjXRYY4hk-7A https://www.facebook.com/winbondcorp https://www.linkedin.com/company/winbond...

WIN SOURCE made its debut at embedded world Germany. In the interview, they discussed their role in the electronic supply chain, strategies for emerging technologies, and innovative supply chain management. This showcased their strength and professionalism in component procurement and management, ensuring a continuous industry-leading position and high-quality customer service. Video: Priya Atwal, emap http://www.twitter.com/win_source…

Lee Harrison, Product Marketing Director for Tessent Safety and Security technology, talks about how security is playing a huge part in the development of self-driving cars and key areas of innovation where (Siemens Digital Industries Software) is focused to ensure that needs of the automotive supply chain are met now and in the future, with…

We can all do one thing… Climate change is the biggest challenge we face. ‘Going green’ is a choice for life, and even small changes – if made by a large number of people – can make a huge difference. From Energy creation to Energy consumption: Panasonic Industry’s wide range of sustainable solutions https://www.linkedin.com/company/panasonic-industry-europe/ Website:…

Longsys, an exhibitor at Embedded World 2022, announced that it will be joining its industry storage brand FORESEE in participating in Embedded World 2023, which will be held in Nuremberg, Germany, from March 14h to 16, 2023. Located at booth 1-112, Longsys will share several success stories and storage solutions for automotive, industrial, consumer electronics,…

Electronics Weeklys Group Editor, Clive Couldwell caught up with NXP and Microchip in Nuremberg at Embedded World 2023. With Brian Carlson - Director of Global Product and Solutions Marketing at NXP - he discussed software-defined vehicles, vehicle architectures and the role of MCUs. And with Ronny Tittoto - Embedded Solution Engineer, Security Function Group, at…

Electronics Weeklys Group Editor, Clive Couldwell, caught up with MikroE and BrainChip in Nuremberg at Embedded World 2023 to discuss their technologies in more depth. With Nandan Nayampally - CMO of BrainChip - he discussed neuromorphic computing, how it works and possible applications. And with Neb Matic - CEO of MikroElektronika - they considered remote…

At Embedded World 2022 in Nuremberg we took advantage of the show to interview Jess Isquith, President of PICMG. Talking points in the interview include Computer-on-Modules and carrier cards, the COM-HPC specification, bridging the gap with COM Express and processor agnostic open specifications. Thank you to Jess for her time. Video: emap

At Embedded World 2022 in Nuremberg we took advantage of the show to interview Zeljko Loncaric, a Marketing Engineer at Congatec. Talking points in the interview include computer-on-modules and COM-HPC, moving beyond maker boards, listening to the customer, and working at the Edge. Thank you to Zeljko for his time. Read all our Embedded World…

At Embedded World 2022 in Nuremberg we took advantage of the show to interview Ansgar Hein, the Chairman of SGET. Talking points in the interview include the role of SGET, the main advantages of computer-on-modules (COMs), the evolution of standards and miniaturisation, and what the future holds. Thank you to Ansgar for his time. Read…