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TSMC Announces Breakthrough Set to Redefine the Future of 3D IC - Taiwan Semiconductor (NYSE:TSM)

New 3Dblox 2.0 and 3DFabric Alliance Achievements Detailed at 2023 OIP Ecosystem Forum TSMC ((TSE: 2330, NYSE:TSM) today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation
United States Mark Fuselier Technology Platform Ecosystem Forum Dfabric Alliance Achievements Detailed Dfabric Alliance Achievements

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Synopsys Unveils Industry's Broadest Portfolio of Automotive-Grade IP on TSMC's N5A Process Technology

Adopted by Multiple Leading Companies, Synopsys Interface and Foundation IP Enable High Reliability for ADAS SoCs Highlights: New Synopsys IP for the TSMC N5A meets automotive Grade 2 temperature...
Kelli Wheeler John Koeter Dan Kochpatcharin Design Infrastructure Management Division Foundation Ip Enable High Reliability Silicon To Software

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