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Local Group Offers Additional Testing Options

Stories about long lines and long waits for COVID-19 testing seem to be everywhere. A local group, COVID Testing Solutions, is offering an alternative.

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MacDermid Alpha to Promote Latest Interconnect Technologies at the productronica Europe Exhibition

MacDermid Alpha to Promote Latest Interconnect Technologies at the productronica Europe Exhibition
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MacDermid Alpha to Promote Latest Interconnect Tech, Present on Microvia Reliability at 2021 Virtual IPC APEX EXPO

Printer Version MacDermid Alpha to Promote Latest Interconnect Tech, Present on Microvia Reliability at 2021 Virtual IPC APEX EXPO MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021. The Circuitry Solutions division will highlight the Affinity family of ENIG and ENEPIG final finishes, including their new reduction assisted gold plating process Affinity 3.0, as well as their complete line of leading-edge metallization processes for exceptionally reliable copper filled microvias. Additional details about the newly installed final finish pilot line at their Waterbury, CT Innovation Center and accompanying partnership initiative will be provided.

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MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding Materials

MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding Materials The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications. Both ALPHA HiTech CU21-3240 and ALPHA HiTech CU31-2030 are one-component capillary underfills which are designed for the protection of assembled chip packages onto printed circuit boards, providing excellent reliability performance. ALPHA HiTech CU21-3240 exhibits good thermal cycling performance due to its low coefficient of thermal expansion. It is suitable for applications wi

Hitech underfillsAssembly division of macdermid alpha electronics solutionsAssembly divisionMacdermid alpha electronics solutionsTech underfillsTransition glass temperatureLow coefficient thermal expansionFlip chipDrop shockImpact bendThermal cycleசட்டசபை பிரிவுமாற்றம் கண்ணாடி வெப்ப நிலைபுரட்டு சிப்கைவிட அதிர்ச்சிதாக்கம் வளைவு