Thermal Simulation News Today

Cadence system analysis and simulation tools help you solve electromagnetic (EM), electronic, thermal, and electromechanical simulation challenges.

Job: Thermal Simulation Engineer - Reality Labs at Meta Redmond, WA, United States

Innosilicon, a domestic IP provider, ASIC design house, and GPU-enabled leader, announced the first homegrown development of Chiplet solution compatible with the UCIe standard IP solution - Innolink™ Chiplet, which is the first cross-process, cross-package Chiplet connectivity solution, and has been successfully verified in mass production on advanced processes.