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February 2, 2023
HSINCHU, Taiwan & SAN JOSE, Calif., February 2, 2023—United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market. UMC’s…
February 1, 2023
United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the... | February 1, 2023
October 22, 2022
Cadence system analysis and simulation tools help you solve electromagnetic (EM), electronic, thermal, and electromechanical simulation challenges.
October 27, 2021
Highlights: ● The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems ● The Tempus Timing Signoff Solution with inter-die analysis and STA technologies results in faster time to tapeout ● The Voltus IC Power Integrity Solution, tightly coupled with the…
August 17, 2021
Cadence Design Systems, Inc. (Nasdaq: CDNS) and Tower Semiconductor (Nasdaq/TASE: TSEM), the leading foundry of high-value analog semiconductor...
December 17, 2020
December 17, 2020 Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications SAN JOSE, Calif., December 16, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence® system analysis and advanced packaging design tool flo...
December 16, 2020
Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence ® system analysis and advanced packaging design tool flow as a Samsung Mu...