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Renesas Expands RA MCU Family with Two New Entry-Line Groups Offering Optimal Combination of Performance, Features and Value

Düsseldorf, March 14, 2023 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its 32-bit RA family of microcontrollers (MCUs) with two new Groups based on the Arm® Cortex®-M33 core with Arm TrustZone® technology. The new 100-MHz RA4E2 Group and 200-MHz RA6E2 Group are optimized to provide best-in-class power efficiency without…
Tom Hackenberg Renesas Mcus Renesas Electronics Corporation Yole Group Technology Analyst For Computing Renesas Flexible Software Package

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Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification.

A Chiplet interconnection specification optimized for maximum applicability enabling low cost and energy efficient implementations. AUSTIN, Texas, July 20, 2022 /PRNewswire/ -- Today, the OCP Foundation, the nonprofit organization bringing hyperscale innovations to all, announced the release of the Bunch of Wires (BoW)specification for Chiplet interconnect. The BoW specification represents a next step in the OCP Open Domain Specific Architecture (ODSA) Project'smarch towards establishing an ...
United States Dirk Van Slyke Bill Carter Tom Hackenberg Computing Division Computing Software Semiconductor

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