UMC Introduces Industry's First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era
News Highlights: UMCs 3D IC solution for RFSOI reduces circuit footprint by more than 45%, enabling integration of more RF components in 5G-enabled devices. UMCs innovative 3D IC technology...
United States South Korea Raj Verma Exchange Commission Wavetek Microelectronics Corporation United Microelectronics Corporation
Source: marketscreener.com