Page 4 - Yield Engineering Systems News Today

Semiconductor Packaging News - Exclusive: YES and SPEC Sign Strategic Alliance Agreement

YES (Yield Engineering Systems, Inc.) and SPEC (Semiconductor Process Equipment Corp.) Sign Strategic Alliance Agreement Share Article Agreement covers design, manufacture and distribution of semiconductor equipment “We look forward to combining our knowledge base with YES’s large and ever-growing repository of process expertise to address customer needs,” said Kevin McGillivray, co- founder of SPEC. FREMONT, Calif. (PRWEB) J...

YES Joins Forces with EV Group Competence Center in Austria YES ( Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and "More-than-Moore" applications, today announced it is working with EV Group (https://www.evgroup.com/) and will install a YES EcoCoat monolayer coating system at EVGs NILPhotonics Competence Center in Austria. This collaboration will provide complete process flow demos for prospective semiconductor...

Yield Engineering Systems, Inc. Joins Forces with EV Group Share Article YES EcoCoat™ to be installed at EVG’s NILPhotonics® Competence Center in Austria We believe that this collaboration with EVG will help us to showcase our technologies to companies developing breakthrough products in the semiconductor, life science and AR/VR markets,” said Rezwan Lateef, President of YES. FREMONT, Calif. (PRWEB) April 19, 2021 YES (Yiel...

Winstek Places Second Order for YES (Yield Engineering Systems, Inc.) VertaCure™ XP Share Article YES today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co., Ltd. “The VertaCure XP system’s enhanced capabilities make it especially well-suited for the demands of ‘Beyond Moore’ advanced packaging, and its ability to handle both 200 mm and 300 mm wafers is ideal for our WLCSP applicatio...

YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer Share Article Yield Engineering Systems, Inc. announces that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding, utilized in bringing next-generation HBM (high bandwidth memory) to market. "This new VertaBond system will enable our valued customer’s most advanced HBM development and pilot production,” said Alex Chow, Asia Sales President & General Manager...

YES Receives Repeat, Volume VertaCure Order from Major Foundry Share Article YES announced today that it has received a repeat, volume purchase order from a leading foundry for its VertaCure polyimide curing system and its next-generation VertaCure XP system. “We are very pleased to support this major advanced packaging expansion, and we look forward to working with this high-profile customer to meet their exciting production and technology roadmap,” said Alex Chow, Asia Sales President & G...

YES Adds Deca’s Rapid Cure Technology to its Product Line Share Article Unique UV plus direct thermal exposure process brings throughput & performance advantages “We are extremely pleased to join forces with Deca, an acknowledged leader in the Advanced Packaging field, to enhance our thermal processing portfolio,” said Rezwan Lateef, President of YES. FREMONT, Calif. (PRWEB) January 25, 2021 YES (Yield Engineering Systems, I...

Vinod Mahendroo Joins Yield Engineering Systems as SVP Operations Share Article Mr. Mahendroo, who has directed YES’s Operations functions for the past three months, brings a wealth of experience in building companies to his role. “We are very pleased to welcome Vinod officially to our senior team,” said Ramakanth Alapati, CEO of YES. FREMONT, Calif. (PRWEB) December 21, 2020 YES ([Yield Engineering Systems, Inc.), a leading...

YES EcoCoat Chosen by Leading Biotech Customer to Enable Rapid Point-of-Care Diagnostic Device for COVID-19 Share Article Scalability, uniformity, yield, and throughput were critical decision factors "The ability to control surface chemistry precisely, so as to ensure the robust attachment of immobilized biochemical probes to device substrates, is crucial for success,” says Jonathan Diver Ph.D., Head of Applications in Life Sciences at YES FREMONT, Calif. (PRW...