Cadence collaboration with Arm enables tape-out of next-generation mobile designs Cadence Design Systems has announced that a collaboration with Arm has enabled customers to successfully tape-out next-generation Arm mobile designs.
According to Cadence, customers have successfully taped out mobile SoCs using its tools for the next-generation Arm mobile solution, which includes the Arm Cortex-X2, Cortex-A710, and Cortex-A510 CPUs, Mali-G710 GPU and the DynamIQ Shared Unit-110.
As part of the collaboration, Cadence has fine-tuned its digital and verification full flows on 5nm and 7nm process technologies to drive adoption of the new Arm mobile solution on the Armv9 architecture. In addition, Cadence delivered 5nm and 7nm RTL-to-GDS digital flow Rapid Adoption Kits (RAKs) to enable customers to achieve optimal power, performance and area (PPA) and accelerate time to tape-out.
Cadence Collaboration With Arm Enables Customers to Successfully Tape out Next-Generation Arm Mobile Designs
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Cadence collaborates with Arm to accelerate SoC development
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Cadence Collaborates with Arm to Accelerate Hyperscale Computing, 5G Communications SoC Development
Cadence Design Systems, Inc. announced that it is expanding its collaboration with Arm to speed hyperscale computing and 5G communications SoC development using Cadence® tools and the new Arm® Neoverse™ V1 and Neoverse N2 platforms. To build upon previous silicon successes where leading customers used the first-generation Arm Neoverse N1 platform and Cadence digital and verification tools on 7nm process technologies, Cadence optimized its digital and verification full flows to drive adoption of these latest platforms. Cadence also delivered comprehensive 5nm and 7nm RTL-to-GDS digital flow Rapid Adoption Kits (RAKs) to help customers optimize power, performance and area (PPA) goals and improve productivity.