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Feb 23, 2021 13:22 EST
The Taiwan Semiconductor Manufacturing Company s (TSMC) chairman Dr. Mark Liu has confirmed that the company s next-generation 3nm chip manufacturing node is on schedule. TSMC, which supplies processors to customers all over the world is currently building a facility to manufacture 3nm chips, and the company hopes to commence production for these products next year.
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TSMC s 3nm Will Nearly Double Logic Density Over Its 5nm Node and Deliver an 11% Performance Boost or 27% Power Efficiency Gain
The executive s comments regarding his company s next manufacturing technology confirm that TSMC believes that it will be able to manage both the increased demand for its current and future products at the same time - without letting the recent uptick in demand for automobile products affect its output. They came during his talk at the International Solid-State Circuits Conference (ISSCC) titled Unleashing the Future of Innovation given on Monday
Primarius Will Present an Invited Paper on Spec-Driven Extraction Flow and Exhibit at IEDM 2020
Primarius Will Present an Invited Paper on Spec-Driven Extraction Flow and Exhibit at IEDM 2020
SAN JOSE, Calif., Dec. 15, 2020 This year, the IEEE International Electron Devices Meeting (IEDM) themed “Innovative Devices for a Better Future”, will be held virtually December 12~18. There will be rich technical programs with 41 sessions covering electronics technologies being used much more broadly than ever before to address the world’s most pressing challenges.
Primarius will present ‘Enabling Efficient Design-Technology Interaction by Spec-Driven Extraction Flow’, an invited paper. In Dr. Huanlin Chang’s presentation, he will discuss a new methodology Specification-Driven Extraction Flow (SDEF) to address the inefficiency of the current design technology co-optimization (DTCO) flow. Dr Chang will detail how designers can use SDEF to sign off the technology development