CEA-Leti claims 'breakthrough' for 3-layer integration in AI

IEEE Denver conference hears of feasibility of combining hybrid bonding and high-density through-silicon vias.

Related Keywords

Denver , Colorado , United States , Renan Bouis , Eric Ollier , Technology Conference , Backside Thinning Process Development For High , Electronic Components , Thinning Process Development , Smart Imager , Sensor Applications , High Isolation ,