CIL's new semiconductor packaging facility is taking shape :

CIL's new semiconductor packaging facility is taking shape

It's been 6 months since CIL announced its newly created and UK-based advanced semiconductor packaging facility. The 46,000 square-foot facility – boasting a 15,000 square-foot SO7 (Class 10,000) fully qualified cleanroom – will be ready to come online in late May 2023.

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