DOD, Draper to Support of Computer Chips Advanced Packaging Solutions The Department of Defense (DOD) entered into a $14 million agreement with Draper to enhance the U.S.’s ability for volume production of advanced packaging solutions for computer chips embedded within defense systems. Draper received a $10 million contract from the Defense Production Act (DPA) Title III office. The company also received a $4 million contract from the DOD Industrial Base Analysis and Sustainment (IBAS) office. Draper intends to expand existing domestic supplier production capabilities to produce three dimensional (3D), ultra-high-density microelectronics modules for use in mission critical applications. Draper’s integrated ultra-high-density technology is in high-volume production at i3 Microsystems’ fabrication facility in St. Petersburg, Fla.