Examining whether to gel or pad New electronic product generations bring new challenges associated with thermal management and there are two general types of thermal interface materials: gels (or dispensable gap fillers) and gap filler pads which can be used. However, while both displace air voids and ensure proper heat transfer, each one has distinct advantages depending on the application. Demand for effective thermal interface materials is rising in direct response to changing needs in the electronics packaging market. The objective of thermal management in electronics packaging is the efficient removal of heat from the semiconductor junction to the ambient environment and this process can be separated into three phases: