Avicena demonstrates first microLED based Transceiver IC in 16nm finFET CMOS for chip-to-chip communications at ECOC 2023
SUNNYVALE, Calif. & GLASGOW, Scotland--(BUSINESS WIRE)--Oct 2, 2023--
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SUNNYVALE, Calif. & GLASGOW, Scotland--(BUSINESS WIRE)--Oct 2, 2023--
The fermentation process is pivotal to biotechnology, producing a wide range of key products in a variety of industries.
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In moving processes from bench to pilot and ultimately production fermentors, it is critical to have a reliable scaledown model. Scale-down models...
Examining whether to gel or pad New electronic product generations bring new challenges associated with thermal management and there are two general types of thermal interface materials: gels (or dispensable gap fillers) and gap filler pads which can be used. However, while both displace air voids and ensure proper heat transfer, each one has distinct advantages depending on the application. Demand for effective thermal interface materials is rising in direct response to changing needs in the electronics packaging market. The objective of thermal management in electron...