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Avicena demonstrates first microLED based Transceiver IC in 16nm finFET CMOS for chip-to-chip communications at ECOC 2023 - Vimarsana News

Avicena demonstrates first microLED based Transceiver IC in 16nm finFET CMOS for chip-to-chip communications at ECOC 2023

SUNNYVALE, Calif. & GLASGOW, Scotland--(BUSINESS WIRE)--Oct 2, 2023--

Under the microscope: Improving gas analysis in process development laboratories - Vimarsana News

Under the microscope: Improving gas analysis in process development laboratories

The fermentation process is pivotal to biotechnology, producing a wide range of key products in a variety of industries.

The Society of Chemical Industry (SCI): SCI COP26 Youth Panel Event To Showcase Next Generation's Science Based Climate Change Solutions - Vimarsana News

The Society of Chemical Industry (SCI): SCI COP26 Youth Panel Event To Showcase Next Generation's Science Based Climate Change Solutions

HOPE IN SCIENCE - INTERVIEW OPPORTUNITIES WITH YOUNG SCIENTISTS LONDON, Nov. 2, 2021 /PRNewswire/ -- Combating Climate Change with ChemistryThursday 4 November, 17.00 - 18.00Science

End-User Evaluation Of 30 L And 300 L HyPerforma Single-Use Fermentors And Scale-Down Model - Vimarsana News

End-User Evaluation Of 30 L And 300 L HyPerforma Single-Use Fermentors And Scale-Down Model

In moving processes from bench to pilot and ultimately production fermentors, it is critical to have a reliable scaledown model. Scale-down models...

Examining whether to gel or pad - Vimarsana News

Examining whether to gel or pad

Examining whether to gel or pad New electronic product generations bring new challenges associated with thermal management and there are two general types of thermal interface materials: gels (or dispensable gap fillers) and gap filler pads which can be used. However, while both displace air voids and ensure proper heat transfer, each one has distinct advantages depending on the application. Demand for effective thermal interface materials is rising in direct response to changing needs in the electronics packaging market. The objective of thermal management in electron...