vimarsana.com
Home
Live Updates
Exynos 2400 will benefit from Samsung's new FOWLP tech : vim
Exynos 2400 will benefit from Samsung's new FOWLP tech : vim
Exynos 2400 will benefit from Samsung's new FOWLP tech
Samsung is using the more efficient FOWLP (fan-out wafer-level packaging) chip packaging technology for the Exynos 2400.
Related Keywords
India ,
South Korea ,
Taiwan ,
Taiwanese ,
,
Qualcomm ,
Samsung ,
Flip Chip Ball Grid Array ,
Advanced Packaging ,