Intel plans investment for advanced packaging technologies 04 May 2021 (Last Updated May 4th, 2021 16:48) Multinational technology company Intel has revealed plans for a $3.5bn multi-year investment in its manufacturing facility in Rio Rancho, New Mexico. Share Article Intel’s campus in Rio Rancho, New Mexico. Credit: Walden Kirsch / Intel. Multinational technology company Intel has revealed plans for a $3.5bn multi-year investment in its manufacturing facility in Rio Rancho, New Mexico. The investment will be used to upgrade the facility to support the development of advanced chip packaging technologies, including Intel’s Foveros 3D packaging technology. Using Foveros, the company will be able to develop processors with computer tiles vertically stacked in three dimensions, instead of spreading out flat in two dimensions.