New Electronics - Siemens automates 2.5D and 3D IC design-fo

New Electronics - Siemens automates 2.5D and 3D IC design-for-test for next generation ICs

Siemens Digital Industries Software has introduced the Tessent Multi-die software solution, which it says will help customers speed up and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.

Related Keywords

Ankur Gupta , Laurie Balch , Siemens Digital Industries Software , Tessent Testkompress Streaming Scan Network , Siemens , Pedestal Research , Siemen Tessent Testkompress Streaming Scan Network , Tessent Multi Die , Siemens Digital Industries , Siemen Tessent Multi Die , Boundary Scan Description Language ,

© 2025 Vimarsana