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Siemens automates 2.5D and 3D IC design-for-test with new Tessent multi-die solution

Siemens automates 2.5D and 3D IC design-for-test with new Tessent multi-die solution
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New Electronics - Siemens automates 2.5D and 3D IC design-for-test for next generation ICs

Siemens Digital Industries Software has introduced the Tessent Multi-die software solution, which it says will help customers speed up and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures. ....

Ankur Gupta , Laurie Balch , Siemens Digital Industries Software , Tessent Testkompress Streaming Scan Network , Pedestal Research , Siemen Tessent Testkompress Streaming Scan Network , Tessent Multi Die , Siemens Digital Industries , Siemen Tessent Multi Die , Boundary Scan Description Language ,

DFT for 3D and 2.5D ICs

Siemens Digital Industries Software has introduced the Tessent Multi-die software solution, which helps customers speed and simplify critical ....

Ankur Gupta , Tessent Testkompress Streaming Scan Network , Siemen Tessent Testkompress Streaming Scan Network , Tessent Multi Die , Siemens Digital , Boundary Scan Description Language ,

Siemens Automates 2.5D, 3D IC Design-for-test with New Tessent Multi Die Solution

Siemens Automates 2.5D, 3D IC Design-for-test with New Tessent Multi Die Solution
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