WAKEFIELD, Mass., October 11, 2023. PICMG, a leading consortium for developing open embedded computing specifications, has announced the release of the COM-HPC 1.2 “Mini” specification. Measuring just 95 mm x 70 mm, COM-HPC Mini is nearly half the size of the next-smallest COM-HPC form factor and provides a cost-effective, lower power module for autonomous mobile robots, drones,…