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The PICMG COM-HPC brings low power and high-performance interfaces to drones, mobile robots, and mobile test equipment.

WAKEFIELD, Mass., October 11, 2023. PICMG, a leading consortium for developing open embedded computing specifications, has announced the release of the COM-HPC 1.2 “Mini” specification. Measuring just 95 mm x 70 mm, COM-HPC Mini is nearly half the size of the next-smallest COM-HPC form factor and provides a cost-effective, lower power module for autonomous mobile robots, drones,…

Wakefield, MA., USA / Nuremberg, Germany, June 23, 2022 – The PCI Industrial Computer Manufacturer’s Group (PICMG), a leading consortium for the development of open embedded computing specifications, is excited to announce significant progress on its IoT.X family of specs. Highlighted by the IoT.1 firmware interface and data modeling specification and soon-to-be-ratified IoT.2 network architecture, ongoing…

Wakefield, MA., October 2021 – PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of IoT.1 specification defining a communication standard between sensors / effecters and local IoT controllers such as micro Sensor Adapter Modules (microSAM) already specified by PICMGs IoT.0 specification. The IoT.1 specification defines a firmware interface and low-level data…

PICMG, MicroSAM, and Bringing Plug and Play into IIoT by Amelia Dalton In honor of Embedded Tech Trends (one of my favorite conferences every year) open standards take center stage in this week’s Fish Fry podcast. Doug Sandy (Chief Technical Officer, PICMG) joins us to discuss the role that open specifications play in the future of Industrial IoT. Doug and I dig into the details of PICMG’s new MicroSAM and check out how this new microcontroller-agnostic, ultra-small form-factor module will bring plug and play into the sensor domain.   Links for January 29, 2021