PICMG InterEdge standard opens modular process control systems controleng.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from controleng.com Daily Mail and Mail on Sunday newspapers.
WAKEFIELD, MA., USA, December 8, 2022. PICMG, a leading consortium for the development of open embedded computing specifications, announces that the COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor in record time. This means that the vast majority of the details of the COM-HPC Mini standard have been…
Wakefield, MA., October 2021 – PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of IoT.1 specification defining a communication standard between sensors / effecters and local IoT controllers such as micro Sensor Adapter Modules (microSAM) already specified by PICMGs IoT.0 specification. The IoT.1 specification defines a firmware interface and low-level data…
PICMG releases COM-HPC specification electronicsweekly.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from electronicsweekly.com Daily Mail and Mail on Sunday newspapers.
PICMG Ratifies MicroSAM™ – The New Microcontroller-Agnostic Module Form Factor for the Enablement of Smart Sensors
Wakefield, MA., – PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of the MicroSAM™ specification. MicroSAM is a new microcontroller-agnostic, ultra-small form-factor module for the enablement of smart sensors.
MicroSAM is the first PICMG specification in a series of IIoT-related open standards to reach ratification. It is the only open hardware specification to date that addresses the fast-growing sensor market. MicroSAM enables a fundamentally different IIoT architecture, offering a distributed architecture with true Plug and Play network integration. The specification defines a 32mm x 32mm module hardware platform for traditional sensor vendors wishing to quickly create smart sensors.