MOUNTAIN VIEW, Calif., Nov. 17, 2021 /PRNewswire/ -- Highlights: Single, unified 3DIC platform enables system-driven PPA per cubic mm silicon optimization Synopsys and Samsung Foundry are fostering advanced-node and multi-die packaging innovation and productivity for in-demand applications such as HPC, AI, automotive and 5G To strengthen innovation of complex SoCs for compute-intensive applications such as high-performance…