Synopsys and TSMC Streamline Multi-Die System Complexity wit

Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process

Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process

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, Sanjay Bali , Dan Kochpatcharin , Ansys , Nasdaq , Synopsys Inc , Group At Synopsys , Synopsys , Design Infrastructure Management Division , Synopsys Multi Die System , Universal Chiplet Interconnect Express , Product Management , Synopsys Test ,