In a recent study published in the journal Nano-Micro Letters, researchers from China developed a polymer-based hierarchically multifunctional polyimide composite film comprising of layers of 61.0 weight% graphene oxide/expanded graphite, 23.8 weight% ferric oxide/polyimide, and polyimide fibers to be used as a flexible, heat-dissipating, and electromagnetic interference (EMI) shielding film for electronic devices.