Maker of AI chip announces $3.87B facility, largest-ever investment in Indiana
Purdue's president said SK Hynix's investment would be the largest ever in Indiana and move the state to the forefront of AI in America.
Source: wishtv.com
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SK hynix plans $4 billion advanced chip packaging facility for Indiana, USA
SK hynix will invest around $4 billion in building an advanced chip packaging facility in West Lafayette, a western city of Indiana, USA.
Source: tweaktown.com
Chip Assembly: Behind the scenes: Inside Intel's advanced chip packaging, assembly, and testing facilities in Malaysia
Intel recently provided a tour of its chip packaging, assembly, and testing facilities in Malaysia. The Penang Assembly and Test (PGAT) facility assem
Source: indiatimes.com
TSMC leads in advanced chip packaging wars, LexisNexis patent data says, ET Telecom
The data from LexisNexis, released last month, indicates that TSMC and Samsung have steadily invested in advanced packaging technology for years, as Intel did not keep pace with its own filings.
Source: indiatimes.com
TSMC Invests $2.87 Billion In Advanced Chip Packaging Plant In Taiwan To Meet AI Demand
(CTN NEWS) - Taiwan Semiconductor Manufacturing Company (TSMC) has recently revealed its ambitious plan to make a substantial investment of approximately
Source: chiangraitimes.com