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The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D.
The US has allocated $3 billion of Chips Act money to its National Advanced Packaging Manufacturing Program (NAPMP) with the aim of developing “critical
The Commerce Department says the U.S. has just 3% of the world's packaging capacity—compared with an estimated 38% in China—which Washington worries has left the country vulnerable.
The U.S. Commerce Department is launching a $3 billion program to stimulate the domestic chip-packaging industry, a key link in the semiconductor supply chain that Washington worries has become dominated by Asia.
The U.S. government is planning to subsidizing the creation of advanced packaging facilities in America with a $3 billion allocation of CHIPS funding.