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Demand for advanced packaging has been weak so far in 2023 compared to previous years, with high-performance computing (HPC) chips showing better momentum than handset application processors (AP), according to industry sources.
Takeaways from Biden Administration’s Initiative to Promote Equal Opportunity in Federally Funded Infrastructure Projects - On March 14, 2023, the U.S. Department of...
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91 billion) and CNY3.23 billion. EPS for the year came to CNY1.82.
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking applications. GLink 2.3LL die-to-die interface provides best-in-class power, performance, and area (PPA) with 5ns end-to-end latency, 5Tbps/mm beach-front (2.5T full-duplex) and 0.27pJ/bit power efficiency. The test chip is taped out at the TSMC 3nm process and adopts the TSMC CoWoS advanced packaging technology.
Harel Insurance Investments & Financial Services Ltd. boosted its position in Camtek Ltd. (NASDAQ:CAMT – Get Rating) by 2,787.1% during the fourth quarter, according to the company in its most recent disclosure with the Securities & Exchange Commission. The fund owned 431,038 shares of the semiconductor company’s stock after buying an additional 416,108 shares during […]