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Students and technicians around the world can learn how to operate a die bonder using a desktop virtual reality tool training simulation developed by MIT researchers and others.
One day after President Joe Biden signed the bipartisan CHIPS and Science Act of 2022 into law, U.S. Sen. Elizabeth Warren visited MIT.nano to tour the cutting-edge facility and discuss how the legislation will boost domestic microelectronics research and manufacturing, and grow the semiconductor workforce.
The Lab for Education and Application Prototypes (LEAP), in MIT.nano, is a research laboratory that also functions as a blended learning classroom for learning how to package electronic and photonic chips.
Department of Defence MII partnership creates US workforce development tool to teach students about silicon photonics.
Worcester Polytechnic Institute (WPI) researchers Pratap Rao, Cagdas Onal, and Zhi Li have been awarded $1,764,938 in federal and state funds to develop a soft, lightweight glove equipped with printed sensors and electronic circuits that will enable a user to tele-operate or train robotic systems.