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Operator: Greetings and welcome to the Kulicke & Soffa 2024 Second Quarter Results Conference Call. At this time, all participants are in a listen-only mode.
Kulicke and Soffa Industries has received a sizeable order from a fast-growing Assembly and Test customer. The order consists of 1,000 RAPID Pro systems, upgraded with the latest ProSuite response-based bonding and looping processes.
Challenges Overshadow Operational Efforts Amidst Financial Turbulence
NexLogic Technologies, Inc. Announces Installation of Finetech FINEPLACER® lambda Sub-Micron Die Bonder on Its PCB Microelectronics Assembly Floor Share Article NexLogic Technologies, Inc., an EMS provider offering both PCB SMT and microelectronics assemblies, announces the installation of a highly advanced Finetech FINEPLACER® lambda sub-micron die bonder system in its PCB microelectronics assembly line. According to the manufacturer, Finetech, the new die bonder has accuracies of 0.5 µm and is designed for precision die attach and advanced chip packaging. FineTech Lambda Machine Technolo...