DOD Enters $14M Agreement with Draper in Support of Computer Chips Advanced Packaging Solutions
DOD, Draper to Support of Computer Chips Advanced Packaging Solutions The Department of Defense (DOD) entered into a $14 million agreement with Draper to enhance the U.S.’s ability for volume production of advanced packaging solutions for computer chips embedded within defense systems. Draper received a $10 million contract from the Defense Production Act (DPA) Title III office. The company also received a $4 million contract from the DOD Industrial Base Analysis and Sustainment (IBAS) office. Draper intends to expand exist...