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AMD's CDNA 3 Compute Architecture – Chips and Cheese - Vimarsana News

AMD's CDNA 3 Compute Architecture – Chips and Cheese

Published: December 17, 2023

AMD has a long history of vying for GPU compute market share. Ever since Nvidia got first dibs with their Tesla architecture, AMD has been playing catch up. Terascale 3 moved from VLIW5 to VLIW4 to improve execution unit utilization in compute workloads. GCN replaced Terascale and emphasized consistent performance for both GPGPU and graphics…

Source: chipsandcheese.com
Related Topics:
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Intel Meteor Lake "Core Ultra" CPUs Specs, Performance, Price, & Availability – Everything We Know So Far - Vimarsana News

Intel Meteor Lake "Core Ultra" CPUs Specs, Performance, Price, & Availability – Everything We Know So Far

Published: September 11, 2023

Intel Meteor Lake CPUs mark the next chapter in Chipzilla's hybrid and chiplet based designs with new cores, packaging technologies & more.

Source: wccftech.com
Related Topics:
Caitlin AndersonCrestmonte CoreRedwood CoveRedwood Cove CrestmontMeteor Lake Base TileClient Computing Group SalesMeteor LakeHot ChipsRaptor LakeGen Core UltraNew Redwood CoveNew CrestmontForu SeriesNode ForFor DiscreteOnlyh SeriesComet LakeRocket LakeAlder LakeLake Is For LaptopsCannon LakeRice LakeTiger LakeGen Raptor Lake Refresh DesktopIntel Meteor Lake S
Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs - Vimarsana News

Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs

Published: August 24, 2022

Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future.

Source: tweaktown.com
Related Topics:
Meteor LakeArrow LakeLunar LakeHot ChipsGen CoreFoveros OmniFoveros DirectBump PitchBump DensitySoc TileBase TileIntel NextNtel 3d FoverosIntel Meteor LakeIntel Arrow LakeIntel Lunar Lake3d FoverosChiplet TechnologyGpu Chiplet