UK's CSA Catapult and Sarawak's SMD sign MoU
Collaborations targeted at chip design and manufacturing for automotive and space industries
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Collaborations targeted at chip design and manufacturing for automotive and space industries
The Compound Semiconductor Applications (CSA) Catapult and SMD Semiconductor have signed a memorandum of understanding (MoU) to work together in the design, prototyping and manufacturing of next-generation semiconductor and compound semiconductor chips in the automotive and space industries.
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